Technological features of DC and RF magnetron spatering
Abstract
The analysis of technological features of DC- and RF-magnetron discharges processes was carried out. It is shown that distinctions in the formation and maintenance of the plasma sheath have different effects on the sputtered and deposited material. Plasma potentials and particle fluxes onto the substrate are the main factors of the energy bombardment of the substrate, and are highly dependent on the technological features of the sputtering system.
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References
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