Resistive Switching Behavior of Si/TiO Thin Films for Non-Volatile Memory Applications
Abstract
This study presents the fabrication of Si/TiO thin films deposited in DC mode via magnetron sputtering onto p-type silicon substrates and investigates their temperature-dependent resistive switching (RS) and low-resistance state (LRS) characteristics. The nanostructures were annealed at 420°C to improve crystallinity and interfacial contact. Electrical characterization through I–V measurements revealed clear bipolar RS behavior without the need for an initial forming process. The devices exhibited stable high-resistance (HRS) and low-resistance (LRS) states over multiple cycles. The switching mechanism is explained by the formation and rupture of conductive filaments induced by oxygen vacancies at the Si/TiO interface. Bandgap values obtained from Tauc plots were approximately 3.24 eV for TiO and 3.41 eV for SnO₂. These results confirm that Si/TiO nanothin films are promising materials for next-generation fast, energy-efficient, and rewritable memory devices.
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Copyright (c) 2026 Muradulla T. Normurodov, Odil Ochilov, Ozodbek Y. Yuldashev, Zarnigor A. Karshieva, Nurbek U. Toshboyev

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