Resistive Switching Behavior of Si/TiO Thin Films for Non-Volatile Memory Applications

Keywords: TiO, Magnetron Sputtering, Memristor, Rapid Thermal Annealing (RTA)

Abstract

This study presents the fabrication of Si/TiO thin films deposited in DC mode via magnetron sputtering onto   p-type silicon substrates and investigates their temperature-dependent resistive switching (RS) and low-resistance state (LRS) characteristics. The nanostructures were annealed at 420°C to improve crystallinity and interfacial contact. Electrical characterization through I–V measurements revealed clear bipolar RS behavior without the need for an initial forming process. The devices exhibited stable high-resistance (HRS) and low-resistance (LRS) states over multiple cycles.  The switching mechanism is explained by the formation and rupture of conductive filaments induced by oxygen vacancies at the Si/TiO interface. Bandgap values obtained from Tauc plots were approximately 3.24 eV for TiO and 3.41 eV for SnO₂. These results confirm that Si/TiO nanothin films are promising materials for next-generation fast, energy-efficient, and rewritable memory devices.

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Published
2026-06-10
Cited
How to Cite
Normurodov, M. T., Ochilov, O., Yuldashev, O. Y., Karshieva, Z. A., & Toshboyev, N. U. (2026). Resistive Switching Behavior of Si/TiO Thin Films for Non-Volatile Memory Applications. East European Journal of Physics, (2), 275-279. https://doi.org/10.26565/2312-4334-2026-2-29