INFLUENCE OF BIAS POTENTIAL AND SUBSTRATE ORIENTATION ON CHARACTERISTICS OF DEPOSITED COATING: THE ROLE OF SPUTTERING
Abstract
Influence of atomic sputtering on intrinsic stress and growth rate of the coating made by method of plasma - ion deposition with use of pulsed bias potential and at different incidence angles of ions is theoretically investigated. The formula for intrinsic stress calculation in deposited coating obtained in the model of the nonlocal thermoelastic peak of the ion, taking into account atomic sputtering processes, was used to calculate the stresses in TiN and CrN coatings deposited from Ti+ and Cr+ ion beams, respectively. The stress value for the coatings considered correlates with the modulus of elasticity of the coating material. The stress curve maximum decreases and shifts to the region of higher potentials with increasing angle of incidence. This behavior is due to the sputtering of quasi-stable interstitial defects that determine the level of stress in the deposited coating. A formula is proposed for the coating deposition rate, which takes into account the sputtering of the coating atoms at arbitrary bias potential and the angle of incidence of the ions. It is shown that sputtering sharply reduces the coatings deposition rate and makes it impossible to deposit TiN and CrN coatings in the DC mode at potentials on the substrate exceeding 1.7 kV and 0.7 kV, respectively, and with normal ion incidence. Sputtering has the greatest influence on the intrinsic stress and the growth rate of the coating at ion deposition at inclined angles of incidence α = 45°...70° . The results of the calculations are compared with the available experimental data.
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References
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