Investigation on Electrical Properties of Solid Polymer Sheets (HDPE AND LDPE) at Audio Frequency Range
Two different groups of solid polymer sheets: low density polyethylene (LDPE) sample of thickness 0.006 cm and 0.007 cm along with high density polyethylene (HDPE) sample of the thickness of 0.009 cm, 0.010 cm were taken in this work. The measurement of electrical properties such as dielectric constant, ε' and dielectric loss, ε'' for LDPE and HDPE polymer sheets have been measured using a dielectric cell. The dielectric cell has been fabricated which consists of two circular parallel plates of pure stainless steel each of 5 cm diameter and 2 mm thickness. An impedance bridge (GRA 650A) was used for measurement of capacitance, C, and dissipation factor, D in the audio frequency (AF) range, 100 Hz to 10 kHz. Different samples were loaded in between the two plates of the cell and the capacitance as well as the dissipation factor were estimated from the dial readings of the bridge. Effect of frequency variation on ε', ε'', relaxation time, τ , dissipation factor, tanδ and ac conductivity, σ were also discussed at audio frequency range. The complex permittivity, ε*, related to free dipole oscillating in an alternating field and loss tangent, tanδ were calculated. The frequency-dependent conductivity, dielectric behavior, and electrical modulus, both real (M') and imaginary (M") parts of LDPE and HDPE have been studied in this work. The values of the real part of the electrical modulus (M') did not equal to zero at low frequencies and it is expected that the electrode polarization may develop in both sheets. These findings reveal an increased coupling among the local dipolar motions in a short-range order localized motion. The analysis of real (ε') and imaginary (ε'') parts of dielectric permittivity and that electrical modulus real (M') and imaginary (M") parts signify poly dispersive nature of relaxation time as observed in Cole-Cole plots.
S.K. Dash, S. Kant, B. Dalai, M.D. Swain, and B.B. Swain, Ind. J. Phy. 88, 129-135 (2014), https://doi.org/10.1007/s12648-013-0395-0.
M.M. Solovan, H.M. Yamrozyk, V.V. Brus, P.D. Maryanchuk, East Eur. J. Phys. 4, 154-159 (2020) https://doi.org/10.26565/2312-4334-2020-4-19.
S. Ghatge, Y. Yang, J.H. Ahn, and H.G. Hur, Appl. Biol. Chem. 63, 27 (2020), https://doi.org/10.1186/s13765-020-00511-3.
R.K. Sarker, P. Chakraborty, P. Paul, A. Chatterjee, and P. Tribedi, Arch. Microbiol. 202, 2117–2125 (2020) https://doi.org/10.1007/s00203-020-01926-8.
D. Manas, M. Manas, A. Mizera, P. Stoklasek, J. Navratil, S. Sehnalek, and P. Drabek, Polymers 10, 1361 (2018), https://doi.org/10.3390/polym10121361.
M. Marin-Genesca et. al. Polymers, 12, 1075 (2020), https://doi.org/10.3390/polym12051075.
D.Q. Tan, J. Appl. Polym. Sci. 137, 1–32 (2020), https://doi.org/10.1002/app.49379.
A.D. Scaccabarozzi, J.I. Basham, L. Yu, P. Westacott, W. Zhang, A. Amassian, I. McCulloch, M. Caironi, D.J. Gundlach, and N. Stingelin, J. Mater. Chem. C, 8, 15406–15415 (2020), https://doi.org/10.1039/D0TC03173A.
A. Usman, M.H. Sutanto, M. Napiah, S.E. Zoorob, S. Abdulrahman, and S.M. Saeed, Ain Shams Eng. J. (2020). https://doi.org/10.1016/j.asej.2020.06.011.
K.S. Samra, R. Singh, and L. Singh, J. Macromol. Sci. Part B Phys. 59, 65–76 (2020), https://doi.org/10.1080/00222348.2019.1687139.
R. Singh, K.S. Samra, R. Kumar, and L. Singh, Radiat. Phys. Chem. 77, 53–57 (2008). https://doi.org/10.1016/j.radphyschem.2007.03.004.
L. Wang, C. Liu, S. Shen, M. Xu, and X. Liu, Adv. Ind. Eng. Polym. Res. 3, 138-148 (2020). https://doi.org/10.1016/j.aiepr.2020.10.001.
D.K. Pradhan, R.N.P. Choudhary, and B.K. Samantaray, Int. J. Electrochem. Sci. 3, 597–608 (2008), http://electrochemsci.org/papers/vol3/3050597.pdf.
C.P. Smyth, Dielectric Behavior and Structure, (McGraw-Hill, New York, 1955).
E. A. Collins et.al, J. Chromatogr. Sci. 13, 12A (1975), https://doi.org/10.1093/chromsci/13.7.12A-b.
S.K. Dash, K.C. Mishra, S.N. Mishra, and B.B. Swain, Indian J. Pure Appl. Phys. 43, 287–290 (2005).
A.K. Jonscher, J. Mater. Sci. 24, 372–374 (1989), https://doi.org/10.1007/BF00660983.
S. Karmakar, and D. Behera, Appl. Phys. A, 124, 745 (2018), https://doi.org/10.1007/s00339-018-2165-5.
D.K. Ray, A.K. Himanshu, and T.P. Sinha, Indian J. Pure Appl. Phys. 45, 692–699 (2007), http://nopr.niscair.res.in/bitstream/123456789/2639/1/IJPAP%2045%288%29%20692-699.pdf.
G. Banhegyi, and F.E. Karasz, J. Polym. Sci. Part B Polym. Phys. 24, 209–228 (1986), https://doi.org/10.1002/polb.1986.090240201.
S. Hajra, S. Sahoo, R. Das, and R.N.P. Choudhary, J. Alloys Compd. 750, 507–514 (2018), https://doi.org/10.1016/j.jallcom.2018.04.010.
G.M. Nasr, T.A. Mohamed, and R.M. Ahmed, IOP Conf. Ser. Mater. Sci. Eng. 956, 012002 (2020).
S.A. Saafan, M.K. El-Nimr, and E.H. El-Ghazzawy, J. Appl. Polym. Sci. 99, 3370–3379 (2006), https://doi.org/10.1002/app.23054.
B.A. Shujah-Aldeen, M.Sc. Thesis, University of Sulaimani Iraq, 2007.
A.K. Himanshu, D.K. Ray, and T.P. Sinha, Indian J. Phys. 79, 1049-1052 (2005).
H.S. Mohanty, A. Kumar, B. Sahoo, P.K. Kurliya, and D.K. Pradhan, J. Mater. Sci. Mater. Electron. 29, 6966–6977 (2018), https://doi.org/10.1007/s10854-018-8683-2.
Authors who publish with this journal agree to the following terms:
- Authors retain copyright and grant the journal right of first publication with the work simultaneously licensed under a Creative Commons Attribution License that allows others to share the work with an acknowledgement of the work's authorship and initial publication in this journal.
- Authors are able to enter into separate, additional contractual arrangements for the non-exclusive distribution of the journal's published version of the work (e.g., post it to an institutional repository or publish it in a book), with an acknowledgement of its initial publication in this journal.
- Authors are permitted and encouraged to post their work online (e.g., in institutional repositories or on their website) prior to and during the submission process, as it can lead to productive exchanges, as well as earlier and greater citation of published work (See The Effect of Open Access).