Identification of patterns of electroerosive diamond grinding based on the temperature factor

Abstract

DOI: https://doi.org/10.32820/2079-1747-2020-25-89-98

The mathematical model for determining the temperature during grinding of a straight-line sample moving along the normal to the working surface of the circle at a constant speed was further developed. It is proved that during grinding, the fraction of heat going to the processed sample is much larger than the fraction of heat going to the generated chips. Therefore, with practical accuracy in calculating the grinding temperature, the movement of the heat source along the processed sample can be ignored. This greatly simplifies the analytical dependencies for determining the temperature and opens up new possibilities in terms of analysis and optimization of the structure and parameters of grinding operations based on the temperature criterion.
The basic conditions for reducing the grinding temperature are theoretically determined. They consist mainly in reducing the conditional stresses of cutting (processing energy intensity) and in removing the allowance in small parts during grinding to cool the heated surfaces of the processed sample.
The temperature factor during edm diamond grinding is in many cases the main limitation of the practical application of this effective finishing method. Therefore, the determination of ways to reduce the thermal tension of the edm diamond grinding process is of great theoretical and practical importance, it opens up new technological possibilities for the high-quality processing of parts from hardened steels and other difficult to process materials. The study of thermal processes during edm diamond grinding requires the development of mathematical models that allow optimizing calculations to determine the most effective processing options with a temperature factor. In this regard, the aim of the work is a theoretical justification of the conditions for reducing the grinding temperature and increasing the processing productivity.