Tunable Negative Differential Resistance in SnO2:Co Memristors on p-Si

Authors

DOI:

https://doi.org/10.26565/2312-4334-2025-2-22

Keywords:

SnO2 doped by cobalt, Memristor, Negative differential resistance switching, USP

Abstract

This study investigates the negative differential resistance (NDR) phenomenon in cobalt-doped tin dioxide (SnO2:Co) memristors fabricated on p-type silicon substrates. Using ultrasonic spray pyrolysis (USP), crystalline SnO2:Co thin films were deposited on p-Si substrates with a thin native SiO2 layer. The resulting memristor devices exhibit reproducible bipolar resistive switching between high-resistance (HRS) and low-resistance states (LRS). Key findings include the observation of a distinct NDR region in the current-voltage (I-V) characteristics, specifically in the positive voltage range from approximately +3V to +4V. Within this NDR region, current decreases despite increasing voltage, a characteristic hallmark of this effect. This behavior is attributed to the charge trapping and redistribution within the Co:SnO2 material. The consistent and reproducible nature of the observed NDR effect suggests the potential of SnO2:Co memristors for applications in advanced memory and switching technologies. This work contributes to the understanding of resistive switching mechanisms in Co-doped SnO2 thin films, which are promising materials for next-generation memory devices.

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Published

2025-06-09

How to Cite

Tunable Negative Differential Resistance in SnO2:Co Memristors on p-Si. (2025). East European Journal of Physics, 2, 211-214. https://doi.org/10.26565/2312-4334-2025-2-22

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