Ion implantation, ion-beam mixing during simultaneous ion implantation and metal deposition

Abstract

This article present‘s researching results of ion implantation Ta in Cu monocrystal with different plane. Also the article demonstrates the processes of ion mixing and deposition of ions Ta+ and Cu+ on polycrystalline Al substrate. Effect of crystalline plane line was found. At the same implantation dose the dose at surface layer is different. Possibilities of the simultaneous ion implantation Ta and Cu and deposition on Al substrate are showed. It causes good corrosion resistance, microhardness increasing of the surface layers.