Kinetics and mechanism of cathode copper precipitation from nitrate electrolyte solutions
DOI:
https://doi.org/10.26565/2220-637X-2013-22-24Keywords:
copper, copper electroprecipitation, nitrate electrolyte solution of copper plating, limiting stage, precipitation mechanismAbstract
Kinetics and mechanism of the precipitation of copper from Cu(NO3)2 solutions with HNO3 additions have been investigated. The copper ion reduction has been shown to include the formation of Cu+. The diffusion of Cu+ ions from the electrode surface is the limiting stage. Copper cathode current yield has been established to decrease with the increase of HNO3 concentration because of the side reactions of NO3–-ion reduction and dissolution of copper in the nitric acid. Optimal conditions for the formation of qualitative copper precipitates have been determined.
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